Professor Kin P. Moy Serves as Chairman at USA Delegation for ISO EMC Meeting

STEM Professor Chaired USA Delegation for International Standards Organization (ISO) Electromagnetic Compatibility (EMC) Working Group Meeting in Germany

Kin P. Moy, associate professor of Electrical Engineering Technology served as the chairman of the USA delegation to the International Standards Organization (ISO) EMC test standards development working group meeting at BMW Engineering Center in Munich, Germany in May, 2013. The working group included representatives from major global automotive manufacturers, suppliers, and universities.

The working group is responsible for the development of global automotive EMC test standards to ensure automobiles’ electrical/electronic systems are immune to electromagnetic interference.

Kin P. Moy ISO EMC Delegation
The group smiling with their computers.

In this meeting, the scope of the working group has been expanded to include electromagnetic radiations from the high voltage electrical system from electric vehicles (EV) and Hybrid Electric Vehicles (HEV) and its effect on the performance telecommunication system, navigation system, vehicle control system, and safety system. Special focus was also placed on the measurements of Low Frequency Magnetic Fields exposure to the vehicle occupants to ensure emissions levels are below acceptable exposure limits established by the government regulatory agencies.

The standards are often utilized by major global vehicle manufacturers for their product specifications as well as by various government agencies to form the basis for their regulatory requirements.

Currently, Professor Moy also chaired the SAE Electromagnetic Immunity Task Force and ISO TC22/SC3/WG3 United States Technical Advisory Group. He is also Vice Chairperson of SAE EMC Standards Committee and members of various SAE and IEEE technical committees.

The information from these technical committees will be integrated into the lectures and laboratory experiments to prepare our students to meet the technical challenges from the industry.